Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy process /

Description

Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1993. / Vita. Abstract. Includes bibliographical references (leaves 50-51). Also available via the Internet.

Links & Downloads

1. http://scholar.lib.vt.edu/theses/available/etd-03172010-020042/

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/29741668
Date	January 1993
Creators	Grau, Peter F.
Source Sets	OCLC
Language	English
Detected Language	English
Source	This resource online