The dissertation thesis is focused on research and development of modern emission MEMS sensors. The emission sensor based on the field emission from nanostructured materials represents innovative approach to pressure sensing. The nanostructures serve as electron emitter in an electric field between the cathode and anode in the pressure sensor. This electric field is constant and the change in ambient pressure causes the change of distance between electrodes, thereby the electric field is increasing. This intensity is proportional to the emission from the cathode made of nanostructured material. Changing the distance between the electrodes is caused by the deflection of the deformation element - the membrane, which operates the measured pressure. In the current state of the art an extensive research is carried out to find new nanostructured materials with good emission properties. Four nanostructured materials have been chosen and then experimentally prepared and characterized inside the vacuum chamber. For the simulation of diaphragm bending, the chamber is equipped with linear nano-motion drive SmarAct that enables precise changes of the distance between two electrodes inside the vacuum chamber. The computer model to predict the deformation of diaphragm was prepared in the simulation program CoventorWare. The behavior of diaphragm in a wide range of dimensions of the membrane, its thickness and the applied pressure are possible to predict. The dependencies of the current density on the electric field are plotted from the measured emission characteristics of nanostructured materials and thus characterized nanostructured materials can be compared. The dependencies are further converted by Fowler-Nordheimovy theory on the curve (ln(J/E2) vs. 1/E), whose advantage is linear shape. Basic parameters describing the emission properties of characterized nanostructured materials are deducted. Two methods for vacuum packaging of the sensor electrodes are designed. Anodic bonding technology and encapsulating using glass frit bonding are tested. To evaluate the bonding strength, the bonded substrates are tested for tensile strength.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:233623 |
| Date | January 2014 |
| Creators | Pekárek, Jan |
| Contributors | Husák, Miroslav, Vlach, Radek, Vrba, Radimír |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/doctoralThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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