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Empirical characterization of a plated-through-hole interconnect for a multilayer stripline assembly at microwave frequencies

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Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/15658
Date05 1900
CreatorsHopkins, Glenn Daniel
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeThesis
RightsAccess restricted to authorized Georgia Tech users only.

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