Wafer bonding for spaceflight applications : processing and characterisation /

Description

Diss. (sammanfattning) Uppsala : Uppsala universitet, 2005. / Härtill 7 uppsatser.

Links & Downloads

1. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-5853
2. urn:nbn:se:uu:diva-5853

Tags

Mikrostruktur. Rymdteknik.

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/186801874
Date	January 2005
Creators	Jonsson, Kerstin,
Publisher	Uppsala : Acta Universitatis Upsaliensis : Univ.-bibl. [distributör],
Source Sets	OCLC
Language	English
Detected Language	Swedish