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Porovnání výsledků modální analýzy desky plošných spojů dosažených výpočtovým a experimentálním modelováním / Printed Circuit Board Modal Analysis Results Comparison from Experimental and Computational Modeling

Modal analysis of printed circuit board results, gained from computional and experimental modeling, have been compared. Anylyses have been performed on dummy boards (models without electronic components), created as one-layered at first, then as three-layered PCB. Board is usually clamped by its longer edges with wedgelock. In order to enable the realization of boundary conditions in computional and experimental modeling, real clamping has been simplified to simply supported. Computional models have used FEM elements, which are comomnly used in this type of problem. Determined results have been evaluated by comparing the experimental modeling results. Models‘ sensitivity on modification of element length and number of elements through thickness have been performed.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:232000
Date January 2015
CreatorsOplt, Tomáš
ContributorsVosynek, Petr, Tošovský, Jiří
PublisherVysoké učení technické v Brně. Fakulta strojního inženýrství
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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