A leaded and lead-free solder paste evaluation screening procedure

Description

Thesis (M.S.I.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2005. / Includes bibliographical references.

Links & Downloads

1. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&res_dat=xri:pqdiss&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&rft_dat=xri:pqdiss:1425610

Tags

Surface mount technology

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/70078294
Date	January 2005
Creators	Bhave, Aniket.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Web sites. Electronic dissertations.
Source	Online access via UMI: