Return to search

A systems approach to ultra-fine pitch flip chip interconnect packaging

Thesis (Ph. D.)--State University of New York at Binghamton, Systems Science, 2005. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/75487502
Date January 2005
CreatorsNagarkar, Kaustubh Ravindra.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

Page generated in 0.0016 seconds