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Viscoelastic stress analysis and fatigue life prediction of a flip-chip-on-board electronic package /

Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 110-112). Available also in a digital version from Dissertation Abstracts.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/45017812
Date January 1999
CreatorsKoeneman, Paul Bryant,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceDigital version accessible at:

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