Non-invasive thermal profiling of silicon wafer surface during RTP using acoustic and signal processing techniques /

Description

Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 104-108). Available also in a digital version from Dissertation Abstracts.

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1. http://wwwlib.umi.com/cr/utexas/main

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/49497960
Date	January 2000
Creators	Syed, Ahmed Rashid,
Source Sets	OCLC
Language	English
Detected Language	English
Source	Digital version accessible at: