Return to search

Effect of bonding pressure on reliability of anisotropic conductive adhesives [sic] joints in a silicon-to-flex-substrate interconnction

Thesis (M.S.E.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2006. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/316229418
Date January 2006
CreatorsPuthenparambil, Abhilash.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

Page generated in 0.0017 seconds