This paper describes advances in hybrid-lithography process, combining UV-lithography for planar, single mode redistribution layer (RDL) and 2-photon-polymerization direct-laser-writing (2PP-DLW) for micro-mirrors inside RDL-opening. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography and need for broadband UV-LED source are presented. Near square core cross sections and smooth sidewalls are achieved. Openings in full stack with steep sidewalls without residual layer are patterned. To optimize 2PP-DLW-process processing window for both OrmoComp and IP-DIP is thoroughly characterized. Roughness measurements prove feasibility even of coarsely printed structure as reflective μ-mirror for 1550 nm wavelength. Finally these results are applied to periscope probe for wafer-level-testing of edge emitting lasers and proof of concept is shown. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with μ-mirror printing is given.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:91298 |
| Date | 10 May 2024 |
| Creators | Weyers, David, Nieweglowski, Krzysztof, Bock, Karlheinz |
| Publisher | International Microelectronics And Packaging Society (IMAPS) |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | info:eu-repo/semantics/publishedVersion, doc-type:conferenceObject, info:eu-repo/semantics/conferenceObject, doc-type:Text |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | 2380-4505, 10.4071/001c.94847, 10.23919/EMPC55870.2023.10418392, info:eu-repo/grantAgreement/Germany's Federal Ministry of Education and Research/Vertrauenswürdige Elektronik (ZEUS)/16ME0313K//Heterogene Photonik-Elektronik-Plattform für vertrauenswürdige quelloffene Prozessoren/VE-Silhouette |
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