This paper describes technology and process development for a hybrid lithography approach pairing UV-lithography for planar single mode waveguides with 2-photon-polymerization direct-laser-writing for out-of-plane coupling mirrors. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography are presented. Near square core cross sections are achieved. Minimum alignment accuracy at ≈ 3 μm is observed. Cut-back measurement on single mode waveguides shows attenuation of 0.64 dB cm −1 and 1.5 dB cm −1 at 1310 nm and 1550 nm respectively. Up to 2.5-times increase of shear-strength after thermal exposure up to 300 ◦ C is found using shear tests and compared for various surface treatments. Mechanical compatibility to reflow soldering is derived. An extensive study on the pattering of ORMOCER® using 2-photon-polymerization is performed. Flat 45 ◦ -micro mirrors with sub-10 μm dimensions are 3D-printed both in OrmoCore and OrmoComp. Outlook to further research on hybrid lithography integration approach is given.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:88016 |
| Date | 14 November 2023 |
| Creators | Weyers, David, Mistry, Akash, Nieweglowski, Krzysztof, Bock, Karlheinz |
| Publisher | IEEE |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | German |
| Detected Language | English |
| Type | info:eu-repo/semantics/acceptedVersion, doc-type:conferenceObject, info:eu-repo/semantics/conferenceObject, doc-type:Text |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | 978-1-6654-7943-1, 10.1109/ECTC51906.2022.00301, info:eu-repo/grantAgreement/Bundesministerium für Bildung und Forschung/Vertrauenswürdige Elektronik (ZEUS)/16ME0315//Heterogene Photonik Elektronik Plattform für vertrauenswürdige quelloffene Prozessoren/SILHOUETTE |
Page generated in 0.002 seconds