Due to the improvement of luminous efficiency, LED has been applied in general lighting nowadays. However, the efficacy and life of high power LED lamps are degraded for the problem of overheat temperature of the chips. In accordance with the above reason, the thermal management has been important in LED application.
The thesis aims to analyze the thermal problem of high power LED lamp by FEM. In the beginning, we analyzed the temperature curves and thermal stress curves of chips by changing the thickness of AuSn solder in 4 structures. According to the results, the better thickness range and structures were chosen. In the second step, the effect of different sizes of a vapor chamber on the different thermal conductivities of lamp system was discussed. Finally, we orthogonalized all the designed parameters by Taguchi orthogonal array method, and then found the optimal design by comparing the results with the initial analyses.
In this study, we proposed a solution to improve the quality characteristics of LED lamp by Taguchi method. So the effect of each control factors on the performance was able to be determined. For different features of demand, the present study is helpful to achieve the ideal design in manufacturing.
Key words: FEM, high power LED lamps, Taguchi orthogonal array method
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0803112-180920 |
| Date | 03 August 2012 |
| Creators | Zou, Han-Cheng |
| Contributors | Jin-Jhy Jeng, Shi-Pin Ho, Shyue-Jian Wu, Jih-sheng Lo |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0803112-180920 |
| Rights | user_define, Copyright information available at source archive |
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