In this thesis I will evaluate few discrete devices and their differences in structure, static and switching characteristics and also some structurall and manufacturing principles. After that I will follow up with their integration into power modules , where I will also aim on construction solutions and trends. These power moduls are today delivered as „stack“ or „system“, where for optimization and highest achievable efficiency of the whole unit the integration of protection, drive and cooloing stage is incorporated. Cooling and drive of some devices will be subject of a separate chapter. Also some of novel materials, which are very promissing, will be introduced. They show improvemnet in electrical and thermal properties. They have potential to replace the currently dominant Silicon in the near future.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:318410 |
| Date | January 2017 |
| Creators | Gama, Richard |
| Contributors | Adámek, Martin, Boušek, Jaroslav |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Slovak |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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