<p dir="ltr">Printed Circuit Boards have become a vital component in the connected world in which we live in today. They can be found in all electronic devices, but their shape and function has been limited by the manufacturing capabilities of PCBs. The methods for manufacturing PCBs are well researched and optimized but have pitfalls as they are only capable of producing two dimensional, planar devices. As the demand for more integrated circuitry and electronics in devices like wearable technologies increases so will the need for a more flexible method for producing PCBs.</p><p dir="ltr">The purpose of this study was to create and analyze a method of creating PCBs using multi-material 3D printing and an electroplating process. The analysis includes an experimental procedure that will conclude whether the specimens created can conduct electricity at the same level of traditionally manufactured PCBs. This research proposed a procedure for manufacturing the PCBs and a testing apparatus designed to inject current at a specified level into the specimens so that the voltage could be measured. This allowed for the resistance of the specimens to be calculated and compared to known values for common materials used in PCB manufacturing.</p><p><br></p>
| Identifer | oai:union.ndltd.org:purdue.edu/oai:figshare.com:article/25690269 |
| Date | 29 April 2024 |
| Creators | Kevin Michael Simonson (18419358) |
| Source Sets | Purdue University |
| Detected Language | English |
| Type | Text, Thesis |
| Rights | CC BY 4.0 |
| Relation | https://figshare.com/articles/thesis/_b_ELECTROPLATED_3D_PRINTED_CIRCUIT_BOARDS_WITH_UNIQUE_GEOMETRY_b_/25690269 |
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