This graduation thesis addresses questions to thermal profile measurement of PBGA package during solder reflow process. The first part of thesis deals with problem of reflow process and reliability factors of solder joint connection. Next part analyses operation principles of thermocouples that are commonly used for temperature measurement. The experimental part deals with methods of thermocouples fixation during tests and measurements of dummy PBGA package. There was realized a method of dummy PBGA thermal profiles measurement and sample testing with and without simulated thermal load on PBGA package. The end of thesis concerns on possibilities of thermal profiles evaluation by using PWI method and thermal profile optimization of reflow process.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:217626 |
| Date | January 2008 |
| Creators | Tomčáková, Anna |
| Contributors | Bureš, Tomáš, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Slovak |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
Page generated in 0.0099 seconds