The performance of smart structures depends on the electromechanical behaviour of piezoelectric sensors/actuators and the bonding condition along the interface, which connects the sensor/actuator
and the host structures. This thesis documents a theoretical study
of the influence of material parameters of the imperfect bonding
layer on the coupled electromechanical characteristics of piezoelectric sensors/actuators. A one dimensional sensor/actuator model
with an imperfect bonding layer, which undergoes a shear deformation, is proposed. The emphasis of the current study is on the local
stress and strain fields near imperfectly bonded sensors/actuators
and the load transfer. Analytical solutions based on the integral
equation method are provided. Detailed numerical simulation is
conducted to evaluate the influence of the geometry and the material mismatch of the adhesive layer upon the sensing/actuating process. The interfacial debonding and its effect upon the strain/stress
distribution and the overall performance of the integrated structure
are evaluated in detail.
| Identifer | oai:union.ndltd.org:LACETR/oai:collectionscanada.gc.ca:AEU.10048/546 |
| Date | 11 1900 |
| Creators | Jin, Congrui |
| Contributors | Wang, Xiaodong (Mechanical Engineering), Zuo, Mingjian (Mechanical Engineering), Wang, Xiaodong (Mechanical Engineering), Zuo, Mingjian (Mechanical Engineering), Schiavone, Peter (Mechanical Engineering), Li, Dongyang (Chemical Engineering) |
| Source Sets | Library and Archives Canada ETDs Repository / Centre d'archives des thèses électroniques de Bibliothèque et Archives Canada |
| Language | English |
| Detected Language | English |
| Type | Thesis |
| Format | 592267 bytes, application/pdf |
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