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Modification of polyimide films via tin complex incorporation

The modification of polyimide films by tin-complex incorporation has been studied with the aim of producing materials with the mechanical and thermal properties of polyimide with enhanced electrical properties. A variety of Sn(II) and Sn(IV) complexes have been incorporated into BTDA/ODA (3,3 14,4 1-benzophenonetetracarboxylic acid dianhydride / 4,41- oxydianiline) and PMDA/ODA (pyromellitic dianhydride/4,4 1 -oxydianiline) derived polyimides in a 1:4 (complex/polymer repeat unit) molar ratio. Tin-complex incorporation was seen to have a variety of effects upon polyimide properties, depending upon the particular tin-complex employed. All films produced were thermally stable with decomposition temperatures> 500°C. Most films were homogeneous and flexible. / Master of Science

Identiferoai:union.ndltd.org:VTETD/oai:vtechworks.lib.vt.edu:10919/44468
Date28 August 2003
CreatorsEzzell, Stephen A.
ContributorsChemistry, Taylor, Larry T., Harris, Paul J., McGrath, James E.
PublisherVirginia Tech
Source SetsVirginia Tech Theses and Dissertation
Detected LanguageEnglish
TypeThesis, Text
Formatviii, 94 pages, 2 unnumbered leaves, BTD, application/pdf, application/pdf
RightsIn Copyright, http://rightsstatements.org/vocab/InC/1.0/
RelationOCLC# 10774687, ezzell.pdf

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