Angioplasty over the years has proven to be an excellent substitute for open heart surgery where an artery/vien, blocked by atherosclerosis, is expanded using a stent. Metallic and coated metallic stents have been used for angioplasty. Metal stents might induce blood clotting, release cytotoxic heavy metal ions which are potential inducers of allergies, clotting, immune reactions and hyperproliferation of smooth muscle cells and also lead to protein absorption which activates clotting factors. Biodegradable polymers have also been tried as stent materials, but the loss of radial strength over time is a big problem associated with them. The use of a hybrid stent, consisting of biodegradable polymer and biocompatible stainless steel, is proposed. The use of such a system would require excellent adhesion between the stent metal and the biodegradable polymer. This study presents the electrochemically induced micromechanical interlocking to enhance adhesion between 304 stainless steel and high density polyethylene. High density polyethylene was used instead of biodegradable polymer for initial investigation.
Electrochemical etching on the stainless steel wire was accomplished by immersing a stainless steel wire in a sodium carbonate electrolyte while applying a known voltage through the wire. The electrochemical etching of the stainless steel wire resulted in pitting under suitable conditions. The etching time, voltage and electrolyte concentration were varied to achieve different pit sizes and pit distributions on the stainless steel wire. An image analysis was conducted using an image analysis software to find the exact pit size and pit distribution on the stainless steel wire from electrochemical etching. A statistical model based on design of engineering experiments was derived. Etched and the unetched wires were molded with high density polyethylene and a mechanical test was conducted to measure the force required to pull the wire out of the polymer and verified using calculations based on the pit size and pit distribution of the pits on the surface of the wire.
Electrochemical etching produced burr free surface features. It was observed that the pH level in the electrolyte contributes to the pit size and pit distribution. The results of the statistical model were consistent with the experimental values and it was possible to optimize the electrochemical etching parameters for maximum pit size and pit distribution. It was also observed that while voltage and etching time contribute to pit size and pit distribution, the electrolyte concentration does not have significant effect on the pit size and pit distribution. The calculated pull out force and measured values were off by 22.7%. The lower value of calculated force could result from neglecting some of the smaller pits while performing the image analysis. The average adhesive strength of the etched samples was 276% higher than that of the unetched samples.
| Identifer | oai:union.ndltd.org:tamu.edu/oai:repository.tamu.edu:1969.1/ETD-TAMU-1567 |
| Date | 15 May 2009 |
| Creators | Mohan, Karthik |
| Contributors | Wayne, N. P. Hung |
| Source Sets | Texas A and M University |
| Language | en_US |
| Detected Language | English |
| Type | Book, Thesis, Electronic Thesis, text |
| Format | electronic, application/pdf, born digital |
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