Return to search

Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards

No description available.

1. http://hdl.handle.net/1853/17375
2. 493864

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/17375
Date	08 1900
Creators	Fu, Chia-Yu
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Dissertation
Rights	Access restricted to authorized Georgia Tech users only.