Return to search

Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/17375
Date08 1900
CreatorsFu, Chia-Yu
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeDissertation
RightsAccess restricted to authorized Georgia Tech users only.

Page generated in 0.002 seconds