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Design and Simulation of High Quality-factor Microinductors for Wireless Communication System Applications

This paper aims to design a high-quality-factor suspending micro-inductor and to establish its equivalent circuit model for performance optimization. Two commercial software (Ansoft HFSS and Agilent ADS) are adopts to analysis the influences of quality factor on the geometric parameters and substrate materials. The designed micro-inductors are constructed by one bottom GSG electrode, two supporting copper vias and a spiral suspending copper conducting layer.
As the simulated results of this research, the quality factor of the suspending micro-inductor is increased with the height of air gap, the thickness and width of suspending copper conducting layer and decrease with the number of turns, line space and outer diameter of suspending copper conducting layer. The influences of different shapes of the spiral suspending copper conducting layers on the quality factor of micro-inductors were also investigated. The simulation results well match to the theoretical prediction.
Finally, this thesis has successfully derived two experiential formulas based on the analysis results to estimate quickly the inductance of the suspending micro-inductors with circular and square shape. Compared with the simulation results and realistic measurement results, these experiential formulas demonstrate 94-95% and 90% accuracies respectively.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0811108-231626
Date11 August 2008
CreatorsHung, Kun-ting
ContributorsC.C., R.S., Y.C., Simon, W.L.
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0811108-231626
Rightsnot_available, Copyright information available at source archive

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