Currently, laser module package is a popular product in optical fiber communication. In the laser module package process smallness is the key point, so dimensions control to influence the oscillation, ageing of material of the laser module operation. This study aim to simulate the laser module weld part's von Mises stress and the laser module weld part's von Mises strain (by using a commercial FEM package, ANSYS) in different temperature cyclic, From the finding of the study, different material property and geometry contour affect the laser module¡¦s ability and cyclic lifespan. For instance Thermal shock will influence the von Mises stress, and thermal cyclic influences viscoplastic strain range and use life. In addation, creep, ageing and stress relaxation happen easily in the high temperature. When the temperature fixes at cyclic period, changing dwell time affects more than changing ramp time. Furthermore, the effects of the study of solder¡¦s geometry contour and the solder¡¦s material property, the behavior of thermal, their advantage and their disadvantageously are also compared in this report. The future, the results obtained by the analytical model will refer to interrelated research.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0619102-181235 |
| Date | 19 June 2002 |
| Creators | Chen, Chi-Chuan |
| Contributors | none, none, none, none |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0619102-181235 |
| Rights | not_available, Copyright information available at source archive |
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