Microelectromechanical systems (MEMS) devices have been increasing in popularity for radio frequency (RF) and microwave communication systems due to the ability of MEMS devices to improve the performance of these circuits and systems. This interdisciplinary field combines the aspects of lithographic fabrication, mechanics, materials science, and RF/microwave circuit technology to produce moving structures with feature dimensions on the micron scale (micro-structures). MEMS technology has been used to improve switches, varactors, and inductors to name a few specific examples. Most MEMS devices have been fabricated using planar micro fabrication techniques that are similar to current integrated circuit (IC) fabrication techniques. These techniques limit the thickness of individual layers to a few microns, and restrict the structures to have planar and not vertical features.
One micro fabrication technology that has not seen much application to microwave MEMS devices is LIGA, a German acronym for X-ray lithography, electroforming, and moulding. LIGA uses X-ray lithography to produce very tall structures (hundreds of microns) with excellent structural quality, and with lateral feature sizes smaller than a micron. These unique properties have led to an increased interest in LIGA for the development of high performance microwave devices, particularly as operating frequencies increase and physical device size decreases. Existing work using LIGA for microwave devices has concentrated on statically operating structures such as transmission lines, filters, couplers, and antennas. This research uses these unique fabrication capabilities to develop dynamically operating microwave devices with high frequency performance.
This thesis documents the design, fabrication and testing of LIGA-MEMS variable capacitors that exploit the vertical dimension. Also included are methods to improve both the reliable fabrication and operation of these devices as well as material property characterization. Variable capacitors can be found in systems such as voltage-controlled oscillators, filters, impedance matching networks and phase shifters. Important figures-of-merit for these devices include the quality factor (Q), tuning range and tuning voltage.
Two different types of variable capacitors are presented, a pull-away design and a design based on the principle of leveraged bending. The pull-away style variable capacitors were found to have high Q-factors, especially the devices fabricated using a thick gold device layer. As an example, the small gold half capacitance electrode design features a Q-factor of 95 at an operating frequency of 5.6 GHz and a tuning ratio of 1.36:1 with a tuning voltage range of 0 to 7.8 V.
The design based on leveraged bending significantly improves the tuning ratio to a value of 1.9:1 while still maintaining a high Q-factor similar to those found in the pull-away style designs. A further increase in tuning ratio to a value of approximately 2.7:1 would be possible, based on simulated results, by simply changing the angle of the capacitance electrode in the layout.
To improve device performance and fabrication reliability, modifications were made to both the fabrication process and the device layout. In the fabrication process the exposure step, electroplating step, and the etching process were modified to improve the quality of the resulting devices. In the layout, anti-stiction measures were introduced that reduce the contact area during collapse.
To improve device characterization as well as the feedback link between simulation and fabrication, a set of test structures called VM-TEST was developed to accurately determine the important mechanical material properties of thick electroplated layers. These structures utilize the measurement of the pull-in voltage in cantilever and fixed-fixed beams, along with measured structure dimensions, to accurately extract the mechanical properties. Both nickel and gold test structures were analyzed with extracted Young’s modulus values of 186.2 and 60.8 GPa respectively.
Also presented is a study of the gap shape in cantilever and fixed-fixed beams that significantly reduces the pull-in voltage while still maintaining a required maximum actuator displacement. It was shown that in the case of cantilever beam actuators, an approximately 40% reduction in pull-in voltage is possible, and in the case of fixed-fixed beam actuators, an approximately 30% reduction is possible by simply varying the shape of the gap between the beam and actuator electrode. These results can be used to significantly reduce the pull-in voltage of future designs.
These promising results show that the LIGA fabrication process is capable of producing high performance dynamically operating RF MEMS devices, by exploiting the vertical dimension, not typically performed in most existing RF MEMS designs.
| Identifer | oai:union.ndltd.org:USASK/oai:ecommons.usask.ca:10388/ETD-2012-09-727 |
| Date | 2012 September 1900 |
| Contributors | Klymyshyn, David M., Achenbach, Sven |
| Source Sets | University of Saskatchewan Library |
| Language | English |
| Detected Language | English |
| Type | text, thesis |
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