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Investigation of physical and chemical interactions during etching of silicon in dual frequency capacitively coupled HBr/NF3 gas discharges

Zugl.: Dresden, Techn. Univ., Diss., 2009 / Hergestellt on demand

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/551689988
Date January 2009
CreatorsReinicke, Marco
PublisherDresden Techn. Univ.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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