This diplomas thesis deals with specific technologies and manufacture of BGA and QFN packages. Also summarizes the most used test methods for assessing the reliability for. Describes the making of equipment for soldering in a nitrogen atmosphere, followed by comparison solder joints of BGA and QFN forming in different atmosphere. Finally, summarizes knowledge about the process of soldering and desoldering lead-free solders for BGA packages, followed by experimental evaluation of the causes of malfunction of repaired samples.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219493 |
| Date | January 2012 |
| Creators | Otáhal, Alexandr |
| Contributors | Adámek, Martin, Szendiuch, Ivan |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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