Semester project deals with the theoretical processing of reflow soldering. Describes the process of reflow soldering, description of intermetallic compounds, the influence of heating factor on the reliability and strength of soldered joints.Also deals with the preparation of cross-section, X-ray control, thermal cycling and description of test boards.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:221309 |
| Date | January 2015 |
| Creators | Ježek, Vladimír |
| Contributors | Ing. Karel Dušek, Ph.D., katedra elektrotechnologie, FEL ČVUT Praha, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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