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Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage

Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/268966406
Date January 2008
CreatorsTan, Wei.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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