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Previous issue date: 2015-01-23 / Technological advances encourages the constant exchange of electronic equipment by increasing the amount of waste generated. The concern with the disposal of these wastes is related to the amount of available metals and final disposal, which usually occurs in dumps or landfills. These wastes have precious metals and other trace elements that are released into the environment by leaching from the organic acid attack. Most of these residues has printed circuit boards in which are concentrated the most metals, and the characterization of these plates help to choose the most appropriate recycling processes. This study aimed to characterize the printed circuit boards of mobile phones as its danger and composition as well as preliminarily investigate the possibility of copper recovery via an electrolytic process and test a mixture of coagulant / flocculant in the removal of metals, including copper. The plates were ground knives in order to release the metals and then separating the particle size was made in three fractions of different sizes. Each of the fractions was characterized by digestion in aqua regia, diffraction and X-ray fluorescence characterization, as the danger was performed through recommended by the ABNT NBR 10005. In the fractions resulting from the grain size were performed gravity separations. For the recovery of copper was used in electrolytic technique medium prepared with the electrolyte coming from the gravimetric fraction with a higher concentration of metals. The copper recovery efficiency through electrolytic process was evaluated by the decrease of its concentration in the electrolyte at five different times. Also, the use of coagulant mixture / flocculant had their efficiency assessed by check which proportion coagulant / flocculant used resulted in solution with lower concentrations of metals. It is also made of copper recovery compared by both methods. Mechanical processes are used to promote adequate concentration of most metals with approximately 80% in the coarser fraction using the separation grain size. The characterization results showed that the printed circuit boards of mobile phones are rich in copper, mean values reaching 40%, in addition to having small amounts of gold and silver. In the study of danger, lead levels were found in amounts well above the limit established by ABNT NBR 10004, requiring specific treatments at the disposal of this type of waste. Some proportions coagulant / flocculant used produced better results than others, getting, on average, above 90% removal. The recovery of copper showed better performance using the electrolytic process, compared to that obtained at any ratio coagulant / flocculant used once reached 98.05 % after 40 minutes. It was estimated the average revenue generated in the recovery of metals from the main printed circuit boards of mobile phones discarded in 2013 in Brazil, reaching the amount of US $ 6,182,263.06 / O avan?o tecnol?gico incentiva a troca constante dos equipamentos eletroeletr?nicos aumentando a quantidade de res?duos gerados. A preocupa??o com a disposi??o desses res?duos est? relacionada com a quantidade de metais existentes e sua disposi??o final, que geralmente se d? em lix?es ou aterros. Estes res?duos apresentam metais preciosos e outros elementos tra?os que s?o liberados no meio ambiente pela lixivia??o proveniente do ataque de ?cidos org?nicos. A maior parte destes res?duos possui placas de circuito impresso onde est? concentrada a maior parte dos metais, sendo que a caracteriza??o destas placas ajuda na escolha dos processos de reciclagem mais adequados. Este trabalho teve como objetivo caracterizar as placas de circuito impresso de telefones celulares quanto sua periculosidade e composi??o, bem como investigar preliminarmente a possibilidade de recupera??o de cobre via um processo eletrol?tico e testar uma mistura de coagulante/floculante na remo??o de metais, inclusive cobre. As placas foram processadas em moinho de facas, a fim de liberar os metais e, em seguida, foi feita a separa??o granulom?trica em tr?s fra??es de diferentes tamanhos. Cada uma das fra??es foi caracterizada por digest?o em ?gua r?gia, difra??o e fluoresc?ncia de raios X. A caracteriza??o, quanto ? periculosidade, foi realizada por meio do preconizado pela NBR ABNT 10005. Nas fra??es oriundas da granulometria foram realizadas as separa??es gravim?tricas. Para a recupera??o de cobre foi utilizada a t?cnica eletrol?tica por meio de eletr?lito preparado com a fra??o oriunda da gravimetria com maior concentra??o de metais. A efici?ncia da recupera??o de cobre via processo eletrol?tico foi avaliada por meio da diminui??o de sua concentra??o no eletr?lito em cinco tempos diferentes. J? a utiliza??o da mistura coagulante/floculante teve sua efici?ncia avaliada pela verifica??o de qual propor??o coagulante/floculante utilizada resultou em solu??o com menor concentra??o de metais. Fez-se tamb?m a compara??o de recupera??o de cobre por ambos os m?todos. Os processos mec?nicos utilizados foram adequados para promoverem a concentra??o da maioria dos metais alcan?ando cerca de 80 % na fra??o mais grosseira utilizando-se a separa??o granulom?trica. Os resultados da caracteriza??o mostraram que as placas de circuito impresso de celulares s?o ricas em cobre, alcan?ando valores m?dios de 40 %, al?m de apresentarem pequenas quantidades de ouro e prata. No estudo de periculosidade, foram encontrados n?veis de chumbo em quantidades muito acima do limite estabelecido pela NBR ABNT 10004, sendo necess?rios tratamentos espec?ficos no descarte deste tipo de res?duo. Algumas propor??es de coagulante/floculante utilizadas produziram resultados mais satisfat?rios que outras, ficando, na m?dia, acima dos 90 % de remo??o. A recupera??o de cobre apresentou melhor desempenho utilizando processo eletrol?tico, quando comparado ao obtido a qualquer propor??o de coagulante/floculante utilizada, uma vez que alcan?ou 98,05 % ap?s 40 minutos. Foi estimada a receita m?dia gerada, na recupera??o dos principais metais contidos nas placas de circuito impresso dos telefones celulares, descartados em 2013, no Brasil, chegando-se ao valor de US $ 6.182.263,06.
| Identifer | oai:union.ndltd.org:IBICT/oai:localhost:jspui/1724 |
| Date | 23 January 2015 |
| Creators | Jesus, Theo Antonio de |
| Contributors | Casqueira, Rui de G?es, Costa, Dilma Alves, Costa, Dilma Alves, Campos, Juacyara Carbonelli, Silva, Leonardo Duarte Batista da |
| Publisher | Universidade Federal Rural do Rio de Janeiro, Programa de P?s-Gradua??o em Engenharia Qu?mica, UFRRJ, Brasil, Instituto de Tecnologia |
| Source Sets | IBICT Brazilian ETDs |
| Language | Portuguese |
| Detected Language | English |
| Type | info:eu-repo/semantics/publishedVersion, info:eu-repo/semantics/masterThesis |
| Format | application/pdf |
| Source | reponame:Biblioteca Digital de Teses e Dissertações da UFRRJ, instname:Universidade Federal Rural do Rio de Janeiro, instacron:UFRRJ |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | REFER?NCIA BIBLIOGR?FICA ABINEE. Avalia??o Setorial. Dispon?vel em: <(http://www.abinee.org.br/abinee/decon/decon11.htm>. Acesso em: 20/5/2014. ABRACI, Associa??o Brasileira de Circuitos Impressos. Ampliando mercado de PCI atrav?s da certifica??o. Dispon?vel em: <http://www.abraci.org.br/arquivos/ICI.pdf>. ABRELPE. Panorama dos res?duos s?lidos no Brasil. Panorama dos res?duos s?lidos no Brasil, p. 116, 2012. Dispon?vel em: http://www.abrelpe.org.br/panorama_apresentacao.cfm> ANATEL. N?mero de acessos m?veis no Brasil. Dispon?vel em: <http://www.anatel.gov.br/Portal/exibirPortalInternet.do>. Acesso em: 20/5/2014. ANDRADE, R. Caracteriza??o e Classifica??o de Placas de Circuito Impresso de Computadores como Res?duos S?lidos. Disserta??o de Mestrado. Universidade de Campinas. Campinas, SP, 2002. ANDUEZA, F. Lixo eletr?nico. Dispon?vel em: <http://lixoeletronico.org/blog/voce-que-adora-o-mundo-digital-conhece-seu-lado-sujo>. Acesso em: 27/4/2014. AQUINO, J. A. DE; OLIVEIRA, M. L. M. DE; BRAGA, P. F. A. Ensaios em Meio Denso. Tratamento de Min?rios: Pr?ticas Laboratoriais. p.300, 2007. Rio de Janeiro. BERBADES, A.; BOHLINGER, I.; RODRIGUEZ, D.; MILBRANDT, H.; WUTH, W. Recycling of Printed Circuit Boards by Melting with Oxidising/Reducing Top Blowing Process. EPD Congress, p. 363?375, 1997. BERNARDES, I. P. T. P. Reciclagem de Placas de Circuitos Eletr?nicos. Disserta??o de Mestrado. Universidade Nova de Lisboa, Monte da Caparica, Lisboa, 2009. BEVILAQUA, D.; LEITE, A. L. L. .; GARCIA, O.; TUOVINEN, O. Oxidation of chalcopyrite by Acidithiobacillus ferrooxidans and Acidithiobacillus thiooxidans in shake flasks. Process Biochemistry, v. 38, n. 4, p. 587?592, 2002. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0032959202001693>. Acesso em: 23/5/2014. BISWAS, A. K.; DAVENPORT, W. G.; KING, M.; SCHLESINGER, M. Extractive Metallurgy of Copper. Fourth ed. Elsevier B.V., 2002. BLEIWAS, D.; KELLY, T. Obsolete Computers, ?Gold Mine?, or High-Tech Trash? Resource Recovery from Recycling. U.S. Geological Survey, n. July, p. 4, 2001. Dispon?vel em: <http://pubs.usgs.gov/fs/fs060-01/>. BOSECKER, K. Bioleaching: metal solubilization by microorganisms. FEMS Microbiology Reviews, v.20, n.3-4, p.591?604, 1997. Dispon?vel em: <http://doi.wiley.com/10.1016/S0168-6445(97)00036-3>. 90 BRANDL, H.; FARAMARZI, M. A. Microbe-metal-interactions for the biotechnological treatment of metal-containing solid waste. China Particuology, v. 4, n. 2, p. 93?97, 2006. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S1672251507602449>. Acesso em: 23/5/2014. BRITANNICA, E. Mineral processing. Dispon?vel em: <http://www.britannica.com/EBchecked/topic/383742/mineralprocessing/81313/ Gravity-separation>. Acesso em: 25/4/2014. BURKE, M. The gadget scrap heap. Chemistry World, n. June, 2007. Dispon?vel em: <http://www.rsc.org/images/Gadget scrap heap_tcm18-87902.pdf>. CEMPRE. Pol?tica Nacional de Res?duos S?lidos. Dispon?vel em: <http://www.cempre.org.br/download/pnrs_002.pdf>. Acesso em: 24/5/2014. CHANCEREL, P.; ROTTER, S. Recycling-oriented characterization of small waste electrical and electronic equipment. Waste management (New York, N.Y.), v.29, n.8, p. 2336?52, 2009. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0956053X09001342>. Acesso em: 23/5/2014. CHAVES, A. P.; PERES, A. E. C. Teoria e pr?tica do tratamento de min?rios: britagem, peneiramento e moagem. S?o Paulo, 1999. CHOI, M.-S.; CHO, K.-S.; KIM, D.-S.; KIM, D.-J. Microbial Recovery of Copper from Printed Circuit Boards of Waste Computer by Acidithiobacillus ferrooxidans. Journal of Environmental Science and Health, Part A- Toxic/Hazardous Substances & Environmental Engineering, v.39, n.11-12, p.2973?2982, 2004. Dispon?vel em: <http://www.dekker.com/servlet/product/DOI/10.1081-ESE-200034763>. Acesso em: 23/5/2014. CHRISTIAN LUDWIG, S. S. Municipal Solid Waste Management. 2003. COPPER, A. Why Antimicrobial Copper? Dispon?vel em: <http://www.antimicrobialcopper.com/us/why-antimicrobial-copper/introduction-to-antimicrobial-copper.aspx>. Acesso em: 10/12/2014. CRUZ, H. F. M. M. DA. Estudo da Resist?ncia ? Corros?o em Sistemas Solares T?rmicos. Disserta??o de Mestrado. Universidade do Porto. Porto, 2010. CUI, J.; FORSSBERG, E. Mechanical recycling of waste electric and electronic equipment: a review. Journal of Hazardous Materials, v. 99, n. 3, p. 243?263, 2003. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S030438940300061X>. Acesso em: 1/5/2014. CUI, J.; ZHANG, L. Metallurgical recovery of metals from electronic waste: a review. Journal of hazardous materials, v. 158, n. 2-3, p. 228?56, 2008. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/18359555>. Acesso em: 23/2/2014. 91 DALRYMPLE, I.; WRIGHT, N.; KELLNER, R.; et al. An integrated approach to electronic waste (WEEE) recycling. Circuit World, v.33, n.2, p.52?58, 2007. Dispon?vel em: <http://www.emeraldinsight.com/10.1108/03056120710750256>. Acesso em: 23/5/2014. DEVECI, H.; YAZICI, E.; AYDIN, U.; YAZICI, R.; AKCIL, A. Extraction of copper from scrap TV boards by sulphuric acid leaching under oxidising conditions. Proceedings of Going Green-CARE INNOVATION, p. 7, 2010. DUAN, H.; HOU, K.; LI, J.; ZHU, X. Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns. Journal of environmental management, v. 92, n. 3, p. 392?9, 2011. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/21084150>. Acesso em: 27/5/2014. EHRLICH, H. L. Past, present and future of biohydrometallurgy. Hydrometallurgy, v. 59, n. 2-3, p. 127?134, 2001. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0304386X00001651>. Acesso em: 23/5/2014. ELLINGHAM, H. J. T.; MOORE, S. Electrochemistry and electrometallurgy. Journal of the Institution of Electrical Engineers, v. 69, n. 409, p. 185?192, 1931. Dispon?vel em: <http://digital-library.theiet.org/content/journals/10.1049/jiee-1.1931.0009>. Acesso em: 27/5/2014. EPA, U. S. E. P. A. Statistics on the Management of Used and End-of-Life Electronics. Dispon?vel em: <http://www.epa.gov/osw/conserve/materials/ecycling/manage.htm>. Acesso em: 14/11/2012. EPA, U. S. E. P. A. The Life Cycle of a Cell Phone. Dispon?vel em: <http://www.epa.gov/epawaste/education/pdfs/life-cell.pdf>. Acesso em: 15/3/2014. ESWARAIAH, C.; KAVITHA, T.; VIDYASAGAR, S.; NARAYANAN, S. S. Classification of metals and plastics from printed circuit boards (PCB) using air classifier. Chemical Engineering and Processing: Process Intensification, v. 47, n. 4, p. 565?576, 2008. Dispon?vel em: <http://linkinghub.elsevier.com/retrieve/pii/S0255270106002996>. Acesso em: 23/5/2014. EUROPEAN COMISSION. Directive 2002/96/EC of the European Parliament and of the Council. Dispon?vel em: <http://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32002L0096>. Acesso em: 19/5/2014a. EUROPEAN COMISSION. Restriction of Hazardous Substances in Electrical and Electronic Equipment. Dispon?vel em: <http://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32002L0095>. Acesso em: 19/5/2014b. FIGUEIRA, H. V. O.; ALMEIDA, S. L. M.; LUZ, A. B. Cominui??o. Dispon?vel em: <http://www.cetem.gov.br/publicacao/CTs/CT2004-182-00.pdf>. Acesso em: 28/4/2014. GALBRAITH, P.; DEVEREUX, J. L. Beneficiation of printed wiring boards with gravity concentration. Conference Record 2002 IEEE International Symposium on Electronics and the Environment (Cat. No.02CH37273). Anais. p.242?248, 2002. IEEE. Dispon?vel em: 92 <http://ieeexplore.ieee.org/lpdocs/epic03/wrapper.htm?arnumber=1003273>. Acesso em: 23/5/2014. GARTNER. N?mero de aparelhos celulares vendidos no mundo. Dispon?vel em: <http://www.gartner.com/newsroom/id/2665715>. Acesso em: 13/2/2014. GERBASE, A. E.; OLIVEIRA, C. R. Reciclagem do lixo de inform?tica: uma opportunidade para a qu?mica. Qu?mica Nova, v. 35, n. 7, p. 1486?1492, 2012. GLOE, K.; M?HL, P.; KNOTHE, M. Recovery of precious metals from electronic scrap, in particular from waste products of the thick-layer technique. Hydrometallurgy, v. 25, n. 1, p. 99?110, 1990. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/0304386X9090067C>. Acesso em: 21/5/2014. GOOSEY, M.; KELLNER, R. A Scoping Study End-of-Life Printed Circuit Boards. Environmental Working Group, n. August, 2002a. Dispon?vel em: <http://www.cfsd.org.uk/seeba/TD/reports/PCB_Study.pdf>. GOOSEY, M.; KELLNER, R. A Scoping Study End-of-Life Printed Circuit Boards. Environmental Working Group, ,n. August, p.2, 2002b. Dispon?vel em: <http://www.cfsd.org.uk/seeba/TD/reports/PCB_Study.pdf>. GRAMATYKA, P.; NOWOSIELSK, R.; SAKIEWICZ, P.; AL., E. Recycling of waste electrical and electronic equipment. , v. 20, p. 535?538, 2007. GREENPEACE. Miner?a y Basura Electr?nica. Dispon?vel em: <http://www.greenpeace.org/argentina/Global/argentina/report/2012/contaminacion/inform-raee-V-1.pdf>. Acesso em: 12/11/2014. GUO, J.; GUO, J.; XU, Z.; AL., E. Recycling of non-metallic fractions from waste printed circuit boards: a review. Journal of hazardous materials, v. 168, n. 2-3, p. 567?90, 2009. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/19303702>. Acesso em: 12/3/2014. HAGEL?KEN, C. Recycling of eletronic scrap at umicore precious metals. Acta Metallurgica Slovaca, p. 111?120, 2006a. Dispon?vel em: <http://web.tuke.sk/hf-knkaso/content/veda/konferencie/waste/hageluken.pdf>. HAGEL?KEN, C. Improvising metal returns and eco-efficiency in eletronics recycling - a holistic approach for interface optimization between pre-processing and integrated metals smelting and refining. International Symposium on Eletronics & the Environment, p. 218?233, 2006b. HAGHSHENAS, D. F.; ALAMDARI, E. K.; TORKMAHALLEH, M. A.; BONAKDARPOUR, B.; NASERNEJAD, B. Adaptation of Acidithiobacillus ferrooxidans to high grade sphalerite concentrate. Minerals Engineering, v. 22, n. 15, p. 1299?1306, 2009. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0892687509001769>. Acesso em: 23/5/2014. 93 HAYES, P. C. Process Principles in Minerals and Materials Production. 3rd ed. Brisbane, Queensland, Australia: Hayes Publishing co, 1993. HE, W.; LI, G.; MA, X.; et al. WEEE recovery strategies and the WEEE treatment status in China. Journal of hazardous materials, v. 136, n. 3, p. 502?12, 2006. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0304389406005644>. Acesso em: 11/5/2014. HOFFMANN, J. E. Recovering precious metals from electronic scrap. JOM, v. 44, n. 7, p. 43?48, 1992. Dispon?vel em: <http://link.springer.com/10.1007/BF03222275>. Acesso em: 23/5/2014. HUANG, K.; GUO, J.; XU, Z.; AL., E. Recycling of waste printed circuit boards: a review of current technologies and treatment status in China. Journal of hazardous materials, v. 164, n. 2-3, p. 399?408, 2009. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/18829162>. Acesso em: 24/2/2014. HUISMAN, J.; MAGALINI, F.; KUEHR, R.; et al. Review of Directive 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE). United Nations University, p. 1?11, 2008. Bonn. Dispon?vel em: <http://ec.europa.eu/environment/waste/weee/pdf/final_rep_unu.pdf >. ILYAS, S.; ANWAR, M. A.; NIAZI, S. B.; AFZAL GHAURI, M. Bioleaching of metals from electronic scrap by moderately thermophilic acidophilic bacteria. Hydrometallurgy, v. 88, n. 1-4, p. 180?188, 2007. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0304386X07001077>. Acesso em: 23/5/2014. INTERNATIONAL TELECOMMUNICATION UNION. Measuring Information Society. Geneva, 2013. JACKSON, E. Hydrometallurgical extraction and reclamation. New York: Ellis Horwood Limited, 1986. JIANG, W.; JIA, L.; ZHEN-MING, X. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board. Journal of hazardous materials, v. 161, n. 1, p. 257?262, 2009. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/18554788>. Acesso em: 18/6/2014. KASPER, A. C. Caracteriza??o e Reciclagem de Materiais Presentes em Sucatas de Telefones Celulares. Disserta??o de Mestrado. Universidade Federal do Rio Grande do Sul. Porto Alegre, RS , 2011. KHETRIWAL, D. S.; KRAEUCHI, P.; WIDMER, R. Producer responsibility for e-waste management: key issues for consideration - learning from the Swiss experience. Journal of environmental management, v. 90, n. 1, p. 153?65, 2009. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S030147970700312X>. Acesso em: 7/5/2014. 94 KIM, E.; KIM, M.; LEE, J.; PANDEY, B. D. Selective recovery of gold from waste mobile phone PCBs by hydrometallurgical process. Journal of hazardous materials, v. 198, p. 206?15, 2011. Elsevier B.V. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/22040799>. Acesso em: 18/3/2014. KUMAR, V.; BEE, D. J.; SHIRODKAR, P. S.; et al. Towards Sustainable ?Product and Material Flow? Cycles: Identifying Barriers to Achieving Product Multi-Use and Zero Waste. Energy Conversion and Resources. Anais. v. 2005, p.433?442, 2005. ASME. Dispon?vel em: <http://proceedings.asmedigitalcollection.asme.org/proceeding.aspx?articleid=1581618>. Acesso em: 30/6/2014. LADOU, J. Printed circuit board industry. International journal of hygiene and environmental health, v. 209, n. 3, p. 211?9, 2006. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S1438463906000204>. Acesso em: 5/5/2014. LEE, C. K.; RHEE, K. I.; SOHN, H. J. Recovery of gold from electronic scrap by hydrometallurgical processes. Chawon Risaikring, v. 6, n. 3, p. 36?40, 1997. LEHNER, T. Integrated recycling of non-ferrous metals at Boliden Ltd. Ronnskar smelter. Proceedings of the 1998 IEEE International Symposium on Electronics and the Environment. ISEE - 1998 (Cat. No.98CH36145), p. 42?47, 1998. Ieee. Dispon?vel em: <http://ieeexplore.ieee.org/lpdocs/epic03/wrapper.htm?arnumber=675028>. LI, J.; LU, H.; GUO, J.; XU, Z.; ZHOU, Y. Recycle technology for recovering resources and products from waste printed circuit boards. Environmental science & technology, v. 41, n.6, p.1995?2000, 2007. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/17410796>. LI, J.; LU, H.; LIU, S.; XU, Z. Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field. Journal of Hazardous Materials, v. 153, n. 1-2, p. 269?275, 2008. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/17900802>. Acesso em: 18/6/2014. LI, J.; LU, H.; XU, Z.; ZHOU, Y. Critical rotational speed model of the rotating roll electrode in corona electrostatic separation for recycling waste printed circuit boards. Journal of hazardous materials, v. 154, n. 1-3, p. 331?336, 2008. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0304389407014690>. Acesso em: 23/5/2014. LONG, L.; SUN, S.; ZHONG, S.; et al. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards. Journal of hazardous materials, v. 177, n. 1-3, p. 626?32, 2009. Elsevier B.V. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/20060640>. Acesso em: 24/2/2014. LUZ, A. B.; COSTA, L. S. N.; POSSA, M. V.; ALMEIDA, S. L. M. Tratamento de Min?rios. CETEM/MCT, 1995. 95 LUZ, A. B.; SAMPAIO, J. A.; ALMEIDA, S. L. M. Tratamento de Min?rios. 4a ed. Rio de Janeiro: CETEM/MCT, 2004. METCALF; EDDY. Wastewater Engineering treatment Disposal Reuse. 4a ed. New York: McGraw - Hill Book, 2003. MORAES, V. T. DE. Recupera??o de Metais a Partir do Processamento Mec?nico e Hidrometal?rgico de Placas de Circuito Impressos de Celulares Obsoletos. Tese de Doutorado. S?o Paulo, SP, 2011. MORIN, D.; LIPS, A.; PINCHES, T.; et al. Integrated project for the development of biotechnology for metal-bearing materials in Europe. BioMinE, v. v. 83, p. 69?76, 2006. MURUGAN, R. V.; BHARAT, S.; DESHPANDE, A. P.; VARUGHESE, S.; HARIDOSS, P. Milling and separation of the multi-component printed circuit board materials and the analysis of elutriation based on a single particle model. Powder Technology, v. 183, n. 2, p. 169?176, 2008. Dispon?vel em: <http://linkinghub.elsevier.com/retrieve/pii/S0032591007003634>. Acesso em: 12/3/2014. NATIONS, U. World Population Policies. New York, 2013a. NATIONS, U. World Population Policy. New York, 2013b. NNOROM, I. C.; OSIBANJO, O. Overview of electronic waste (e-waste) management practices and legislations, and their poor applications in the developing countries. Resources, Conservation and Recycling, v. 52, n. 6, p. 843?858, 2008. Dispon?vel em: <http://linkinghub.elsevier.com/retrieve/pii/S0921344908000165>. Acesso em: 3/6/2014. OISHI, T.; KOYAMA, K.; KONISHI, H.; TANAKA, M.; LEE, J.-C. Influence of ammonium salt on electrowinning of copper from ammoniacal alkaline solutions. Electrochimica Acta, v. 53, n. 1, p. 127?132, 2007. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S001346860700802X>. Acesso em: 21/5/2014. OLSON, G. J.; BRIERLEY, J. A.; BRIERLEY, C. L. Bioleaching review part B: progress in bioleaching: applications of microbial processes by the minerals industries. Applied microbiology and biotechnology, v. 63, n. 3, p. 249?257, 2003. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/14566430>. Acesso em: 23/5/2014. ONGONDO, F. O.; WILLIAMS, I. D. Mobile phone collection, reuse and recycling in the UK. Waste management (New York, N.Y.), v. 31, n. 6, p. 1307?15, 2011. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0956053X11000675>. Acesso em: 12/5/2014. PARK, Y. J.; FRAY, D. J. Recovery of high purity precious metals from printed circuit boards. Journal of hazardous materials, v. 164, n. 2-3, p. 1152?8, 2009. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/18980802>. Acesso em: 3/2/2014. 96 PETTER, P. M. H. Avalia??o da Efici?ncia da Lixivia??o de Metais Preciosos das Placas de Circuito Impresso com Utiliza??o de Lixiviantes Alternativos ao Cianeto. Disserta??o de Mestrado. Porto Alegre, RS, 2012. PNUMA, O. Economia verde e desenvolvimento sustent?vel. 2011. PORMIN, M. M. E E. Beneficiamento de min?rios. Dispon?vel em: <http://www.pormin.gov.br/biblioteca/arquivo/beneficiamento_de_minerio.pdf>. Acesso em: 21/4/2014. POURBAIX, M. Atlas of electrochemical equilibria in aqueous solutions. 2nd ed. Houston, Texas: National Association of Corrosion Engineers, 1974. PROCOBRE. Cobre ? material mais amig?vel para o Meio Ambiente. Dispon?vel em: <http://procobre.org/pt/noticias/o-cobre-e-o-material-hidraulico-mais-amigavel-para-o-meio-ambiente/>. Acesso em: 17/9/2014. RIBEIRO, J. A. S. Sum?rio Mineral 2013. Dispon?vel em: <http://www.dnpm.gov.br/conteudo.asp?IDSecao=68&IDPagina=3165>. Acesso em: 13/9/2014. RIBEIRO, J. A. S. Sum?rio Mineral 2014. Dispon?vel em: <https://sistemas.dnpm.gov.br/publicacao/mostra_imagem.asp?IDBancoArquivoArquivo=9561>. Acesso em: 28/10/2014. RON, A.; PENEV, K. Disassembly and recycling of electronic consumer products: An overview. Technovation, v. 15, n. 6, p. 363?374, 1995. Dispon?vel em: <http://linkinghub.elsevier.com/retrieve/pii/016649729596597M>. Acesso em: 13/6/2014. SCHUELP, M.; HAGELUEKEN, C.; KUEHR, R.; et al. Recycling from e-waste to resources. Dispon?vel em: <http://www.unep.org/pdf/Recycling_From_e-waste_to_resources.pdf>. Acesso em: 18/11/2013. SHAPIRO, M.; GALPERIN, V. Air classification of solid particles: a review. Chemical Engineering and Processing: Process Intensification, v. 44, n. 2, p. 279?285, 2005. Dispon?vel em: <http://linkinghub.elsevier.com/retrieve/pii/S0255270104000984>. Acesso em: 23/5/2014. SILVEIRA, A. V. M.; FUCHS, M. S.; MEILI, L.; BERTUOL, D. A. Caracteriza??o e Processamento de Telas de LCD de Celulares visando ? Reciclagem. Revista Eletr?nica em Gest?o, Educa??o e Tecnologia Ambiental, v. 8, n. 8, 2013. Dispon?vel em: <http://cascavel.ufsm.br/revistas/ojs-2.2.2/index.php/reget/article/view/7314>. Acesso em: 25/7/2014. SPEIGHT, J. Lange?s Handbook of Chemistry. Sixteenth ed. McGraw-Hill Education, 2005. TELECO. N?mero de telefones celulares vendidos no Brasil. Dispon?vel em: <http://www.teleco.com.br/celprod.asp>. Acesso em: 26/4/2014. 97 TELLER, M. Recycling of Electronic Waste Material. Springer Netherlands, 2006. TORRES, V. F. N.; GAMA, C. D. DA. Engenharia Ambiental Subterr?nea e Aplica??es. Rio de Janeiro, 2005. TUNCUK, A.; STAZI, V.; AKCIL, A.; YAZICI, E. Y.; DEVECI, H. Aqueous metal recovery techniques from e-scrap: Hydrometallurgy in recycling. Minerals Engineering, v. 25, n. 1, p. 28?37, 2012. Elsevier Ltd. Dispon?vel em: <http://linkinghub.elsevier.com/retrieve/pii/S0892687511003669>. Acesso em: 20/2/2014. UNITED NATIONS, World Population Prospects, The 2012 Revision, DVD Edition. 2013. VEIT, H. M. Emprego do Processamento Mec?nico na Reciclagem de Sucatas de Placas de Circuito Impresso. Disserta??o de Mestrado. Porto Alegre, RS, 2001. VEIT, H. M. Reciclagem de Cobre de Placas de Circuito Impresso. Tese de Doutorado. Porto Alegre, RS, 2005. VEIT, H. M.; PEREIRA, C. C.; BERNARDES, A. M. Using mechanical processing in recycling printed wiring boards. Jom, v. 54, n. 6, p. 45?47, 2002. Dispon?vel em: <http://link.springer.com/10.1007/BF02701850>. VELOSO, Z. M. F. Pol?tica Nacional de Res?duos S?lidos. Dispon?vel em: <www.comprasgovernamentais.gov.br/arquivos/capacitacao/4-a-responsabilidade-do-setor-publico-frente-a-geracao-de-residuos-solidos.pdf>. Acesso em: 29/1/2015. VOLSKY, A.; SERGIEVSKAYA, E. Theory of metallurgical processes. Moscow, 1978. WANG, J.; BAI, J.; XU, J.; LIANG, B. Bioleaching of metals from printed wire boards by Acidithiobacillus ferrooxidans and Acidithiobacillus thiooxidans and their mixture. Journal of hazardous materials, v. 172, n. 2-3, p. 1100?1105, 2009. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/19699031>. Acesso em: 23/5/2014. WIDMER, R.; OSWALD-KRAPF, H.; SINHA-KHETRIWAL, D.; SCHNELLMANN, M.; B?NI, H. Global perspectives on e-waste. Environmental Impact Assessment Review, v. 25, n. 5, p. 436?458, 2005. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0195925505000466>. Acesso em: 29/4/2014. WILLIAMS, J. H.; WILLIAMS, P. T. Separation and recovery of materials from scrap printed circuit boards. Resources, Conservation and Recycling, v. 51, n. 3, p. 691?709, 2007. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0921344906002643>. Acesso em: 1/5/2014. WU, B. Y.; CHAN, Y. C.; MIDDENDORF, A.; GU, X.; ZHONG, H. W. Assessment of toxicity potential of metallic elements in discarded electronics: A case study of mobile phones in China. Journal of Environmental Sciences, v. 20, n. 11, p. 1403?1408, 2008. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S1001074208622408>. Acesso em: 21/5/2014. 98 WU, J.; LI, J.; XU, Z. Electrostatic separation for multi-size granule of crushed printed circuit board waste using two-roll separator. Journal of hazardous materials, v. 159, n. 2-3, p. 230?234, 2008. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/18346846>. Acesso em: 18/6/2014. YAMANE, L. H.; MORAES, V. T. DE; ESPINOSA, D. C. R.; TEN?RIO, J. A. S. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers. Waste management (New York, N.Y.), v. 31, n. 12, p. 2553?2558, 2011. Elsevier Ltd. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/21820883>. Acesso em: 3/2/2014. YANG, T.; XU, Z.; WEN, J.; YANG, L. Factors influencing bioleaching copper from waste printed circuit boards by Acidithiobacillus ferrooxidans. Hydrometallurgy, v. 97, n. 1-2, p. 29?32, 2009. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0304386X08003824>. Acesso em: 23/5/2014. YAZICI, E.; DEVECI, H.; ALP, I.; AK?IL, A.; YAZICI, R. Characterisation of computer PCB for hazardous properties and beneficiation studies. International Mineral Processing Congress. Anais...v. XXV, p.4009?4015, 2010. YAZICI, E. Y.; DEVECI, H. Recovery of metals from E-waste. The Journal of the Chamber of Mining Engineers of Turkey, v. 48, p. 3?18, 2009. YOO, J.-M.; JEONG, J.; YOO, K.; LEE, J.-C.; KIM, W. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill. Waste management (New York, N.Y.), v. 29, n. 3, p. 1132?1137, 2009. Elsevier Ltd. Dispon?vel em: <http://www.ncbi.nlm.nih.gov/pubmed/18835149>. Acesso em: 1/5/2014. YOVANOVIC, A. P. Engenharia da Cominui??o e Moagem em Moinhos Tubulares. Dispon?vel em: <http://modelooperacional.com.br/VisualizadorPublicacoes.aspx?id=14>. Acesso em: 26/4/2014. ZHANG, S.; FORSSBERG, E. Mechanical separation-oriented characterization of electronic scrap. Resources, Conservation and Recycling, v. 21, n. 4, p. 247?269, 1997. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0921344997000396>. Acesso em: 21/5/2014. ZHANG S.; FORSSBERG, E. Mechanical recycling of electronics scrap - the current status and prospects. Waste Management & Research, v. 16, n. 2, p. 119?128, 1998. Dispon?vel em: <http://wmr.sagepub.com/cgi/doi/10.1177/0734242X9801600204>. Acesso em: 20/5/2014. ZHANG, S.; FORSSBERG, E. Intelligent Liberation and classification of electronic scrap. Powder Technology, v. 105, n. 1-3, p. 295?301, 1999. Dispon?vel em: <http://linkinghub.elsevier.com/retrieve/pii/S0032591099001515>. 99 ZHANG, S.; FORSSBERG, E.; ARVIDSON, B.; MOSS, W. Aluminum recovery from electronic scrap by High-Force? eddy-current separators. Resources, Conservation and Recycling, v. 23, n. 4, p. 225?241, 1998. Dispon?vel em: <http://www.sciencedirect.com/science/article/pii/S0921344998000226>. Acesso em: 20/5/2014. ZHAO, Y.; WEN, X.; LI, B.; TAO, D. Recovery of cooper from waste printed circuit boards. Minerals & Metallurgical Processing, v. 21, p. 99?102, 2004 |
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