Return to search

The use of SEM in IC production testing: an in-dept theoretical study. / Use of scanning electron microscopy in integrated circuit production testing

by Chan, Ray. / Thesis (M.Phil.)--Chinese University of Hong Kong, 1994. / Includes bibliographical references (leaves [93-96]). / ACKNOWLEDGMENT / ABSTRACT / FIGURE CAPTIONS / TABLE CAPTIONS / INTRODUCTION / Chapter I. --- PRINCIPLES OF SEM / Chapter 1.1 --- STRUCTURE OF SEM --- p.1-1 / Chapter 1.2 --- IMAGE FORMATION --- p.1-6 / Chapter 1.2.1 --- Electron Beam-Specimen Interaction --- p.1-6 / Chapter 1.2.1.1 --- Electron scattering in solid specimen --- p.1-7 / Chapter 1.2.1.2 --- Electron range and spatial distribution --- p.1-7 / Chapter 1.2.1.3 --- Back scattered electrons(BE) --- p.1-8 / Chapter 1.2.1.4 --- Secondary electron(SE) --- p.1-9 / Chapter 1.2.1.5 --- Other signal types --- p.1-13 / Chapter 1.2.2 --- Types of Image Contrast --- p.1-14 / Chapter 1.3 --- DISTORTION AND NOISE --- p.1-17 / Chapter 1.3.1 --- Lens Aberration --- p.1-17 / Chapter 1.3.1.1 --- Spherical aberration --- p.1-17 / Chapter 1.3.1.2 --- Chromatic aberration --- p.1-18 / Chapter 1.3.1.3 --- Diffraction effect --- p.1-19 / Chapter 1.3.1.4 --- Axial astigmatism --- p.1-20 / Chapter 1.3.1.5 --- Spatial resolution calculation --- p.1-21 / Chapter 1.3.2 --- Image Defects --- p.1-22 / Chapter 1.3.2.1 --- Projection distortion --- p.1-22 / Chapter 1.3.2.2 --- Specimen tilting --- p.1-22 / Chapter 1.3.2.3 --- Moire effects --- p.1-22 / Chapter 1.3.3 --- Noise in SEM --- p.1-23 / Chapter II. --- SEM FOR IC TESTING / Chapter 2.1 --- QUANTITATIVE ANALYSIS OF VOLTAGE MEASUREMENT --- p.2-1 / Chapter 2.1.1 --- Energy Analysis of SEs --- p.2-1 / Chapter 2.1.2 --- Suppression of Local Fields --- p.2-2 / Chapter 2.1.3 --- "Elimination of Topography, Material Contrast and Work Function Variation" --- p.2-2 / Chapter 2.2 --- VOLTAGE RESOLUTION --- p.2-3 / Chapter 2.3 --- TIME RESOLUTION --- p.2-4 / Chapter 2.3.1 --- SE Generation Time --- p.2-4 / Chapter 2.3.2 --- SE Flight Time --- p.2-4 / Chapter 2.3.3 --- Required Voltage Resolution --- p.2-5 / Chapter 2.3.4 --- Electron Beam Pulse Width --- p.2-5 / Chapter 2.4 --- SPATIAL RESOLUTION --- p.2-5 / Chapter 2.5 --- CAPACITIVE COUPLING VOLTAGE CONTRAST --- p.2-6 / Chapter III. --- SEM TESTING TECHNIQUES / Chapter 3.1 --- CONVENTIONAL TESTING METHODS SYNOPSIS --- p.3-1 / Chapter 3.2 --- TESTING TECHNIQUES FOR SEM --- p.3-2 / Chapter 3.2.1 --- Static Mode --- p.3-2 / Chapter 3.2.2 --- Frequency Matching Mode --- p.3-3 / Chapter 3.2.2.1 --- Voltage coding --- p.3-4 / Chapter 3.2.2.2 --- Stroboscopy --- p.3-4 / Chapter 3.2.2.3 --- Waveform measurement --- p.3-6 / Chapter 3.2.2.4 --- Logic state mapping --- p.3-6 / Chapter 3.2.2.5 --- Frequency tracing --- p.3-7 / Chapter 3.2.2.6 --- Frequency mapping --- p.3-8 / Chapter 3.2.2.7 --- Logic state tracing --- p.3-9 / Chapter IV. --- CONVERT AMRAY 1830 INTO E-BEAM TESTER / Chapter 4.1 --- DESIGN CONSIDERATION --- p.4-1 / Chapter 4.1.1 --- Application Consideration --- p.4-1 / Chapter 4.1.2 --- Limitation of the AMRAY 1830 --- p.4-1 / Chapter 4.1.2.1 --- Detection system --- p.4-2 / Chapter 4.1.2.2 --- Scanning driver --- p.4-3 / Chapter 4.1.2.3 --- Beam blanker --- p.4-4 / Chapter 4.1.2.4 --- NibbleNet interface --- p.4-5 / Chapter 4.2 --- HARDWARE ARCHITECTURE --- p.4-6 / Chapter 4.2.1 --- SEM Circuit Varied --- p.4-7 / Chapter 4.2.1.1 --- Adding scanning relays --- p.4-7 / Chapter 4.2.1.2 --- Voltage clippers --- p.4-7 / Chapter 4.2.1.3 --- External scan interface in SEM --- p.4-9 / Chapter 4.2.2 --- PC Interface --- p.4-9 / Chapter 4.2.3 --- Driver Box --- p.4-10 / Chapter 4.2.3.1 --- Data preprocess unit --- p.4-10 / Chapter 4.2.3.2 --- Scanning preprocess unit --- p.4-12 / Chapter 4.2.3.3 --- Control unit --- p.4-12 / Chapter 4.2.4 --- Scanning Generation and Data Acquisition --- p.4-13 / Chapter 4.3 --- SOFTWARE DEVELOPED --- p.4-13 / Chapter 4.3.1 --- Function Library --- p.4-13 / Chapter 4.3.2 --- Integrated Environment --- p.4-14 / Chapter V. --- SYSTEM PERFORMANCE / Chapter 5.1 --- CHARACTERISTICS OF THE SCANNING DRIVERS --- p.5-1 / Chapter 5.1.1 --- Driver Output Changes with Acceleration Voltage --- p.5-2 / Chapter 5.1.2 --- Driver Output Changes with magnification --- p.5-3 / Chapter 5.1.3 --- Frequency Response --- p.5-4 / Chapter 5.1.4 --- Image Distortion --- p.5-7 / Chapter 5.2 --- INTEGRATED STUDY ENVIRONMENT --- p.5-9 / Chapter 5.2.1 --- Setting Status --- p.5-9 / Chapter 5.2.2 --- Image Scanning & Image Saving --- p.5-12 / Chapter 5.2.3 --- Static Probing --- p.5-15 / Chapter 5.2.4 --- Point Probing --- p.5-19 / Chapter 5.2.5 --- Frequency Matching --- p.5-20 / Chapter V. --- SUMMARY --- p.6-1 / REFERENCE / APPENDIX: / Chapter A. --- PROGRAM LISTING / Chapter B. --- CIRCUIT SCHEMATICS

Identiferoai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_318182
Date January 1994
ContributorsChan, Ray., Chinese University of Hong Kong Graduate School. Division of Electronic Engineering.
PublisherChinese University of Hong Kong
Source SetsThe Chinese University of Hong Kong
LanguageEnglish
Detected LanguageEnglish
TypeText, bibliography
Formatprint, [125] leaves : ill. ; 30 cm.
RightsUse of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/)

Page generated in 0.0022 seconds