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Hodnocení struktur spojů pájek s deskami plošných spojů / Evaluation of structures of solder joint with printed board circuit

The theoretical part of the diploma thesis deals with the basic principles of the scanning electron microscope and the environmental scanning electron microscope. A description of the signals generated by an electrons incidence onto a specimen and detection options of these signals in the mentioned microscopes is included in the work. The experimental part of the work concerns an examination of a quality of several joints soldered by different methods on the printed circuit boards after different stresses by use of a visual check and the instruments of the light microscope and the environmental scanning electron microscope. The acquired data are evaluated and summarized.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:217575
Date January 2008
CreatorsJakubec, Jiří
ContributorsJirák, Josef, Černoch, Pavel
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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