Return to search

Direct wafer bonding for MEMS and microelectronics /

Thesis (doctoral)--Helsinki University of Technology, 2006. / Includes bibliographical references. Also available on the World Wide Web.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/162574645
Date January 1900
CreatorsSuni, Tommi.
Publisher[Espoo, Finland] : VTT Technical Research Centre of Finland,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

Page generated in 0.0018 seconds