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Pattern recognition for automated die bonding

published_or_final_version / Electrical Engineering / Master / Master of Philosophy

  1. 10.5353/th_b3120644
  2. b3120644
Identiferoai:union.ndltd.org:HKU/oai:hub.hku.hk:10722/32613
Date January 1982
Creators曾昭明, Tsang, Chiu-ming.
PublisherThe University of Hong Kong (Pokfulam, Hong Kong)
Source SetsHong Kong University Theses
LanguageEnglish
Detected LanguageEnglish
TypePG_Thesis
Sourcehttp://hub.hku.hk/bib/B3120644X
RightsThe author retains all proprietary rights, (such as patent rights) and the right to use in future works., Creative Commons: Attribution 3.0 Hong Kong License
RelationHKU Theses Online (HKUTO)

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