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Copper tin intermetallic compounds in flip chip interconnections

Thesis (M.S.)--San Jose State University, 1995. / Adviser: Guna S. Selvaduray. Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/166084140
Date January 1995
CreatorsLynch, Brian John.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
Sourceaccess full-text online access from Digital Dissertation Consortium

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