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A numerical study of the thermal performance for surface mounted and through-hole mounted integrated circuits

Graduation date: 1995

Identiferoai:union.ndltd.org:ORGSU/oai:ir.library.oregonstate.edu:1957/37349
Date20 December 1994
CreatorsWang, Jyi-Ren
ContributorsBushnell, Dwight J.
Source SetsOregon State University
Languageen_US
Detected LanguageEnglish
TypeThesis/Dissertation

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