A numerical study of the thermal performance for surface mounted and through-hole mounted integrated circuits

Description

Graduation date: 1995

Links & Downloads

1. http://hdl.handle.net/1957/37349

Tags

Integrated circuits -- Evaluation

Semiconductors -- Thermal properties

Additional Fields

Identifer	oai:union.ndltd.org:ORGSU/oai:ir.library.oregonstate.edu:1957/37349
Date	20 December 1994
Creators	Wang, Jyi-Ren
Contributors	Bushnell, Dwight J.
Source Sets	Oregon State University
Language	en_US
Detected Language	English
Type	Thesis/Dissertation