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Processing of NITI reinforced adaptive solder for electronic packaging /

Thesis (M.S. in Mechanical Engineering)--Naval Postgraduate School, March 2004. / Thesis advisor(s): Indranath Dutta. Includes bibliographical references (p. 45-47). Also available online.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/55122097
Date January 2004
CreatorsWright, William L.
PublisherMonterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
Source(2.87 MB)

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