Master’s thesis in the theoretical part analyses the heating factor (Q), which has significant share on quality of a solder joint. The practical part describes the design and production of test PCB and setting temperature profiles, SMD resistors soldering by using BiSn solder paste. Shear tests of SMD solder joints were realised and evaluated including isothermal ageing samples. At the end of master’s thesis solder joints visual aspects and defects were evaluated, measurement thickness of intermetallic compound by not only optical microscope but also SEM, discussion about results and Q was evaluated.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:319630 |
| Date | January 2017 |
| Creators | Kučírek, Martin |
| Contributors | Špinka, Jiří, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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