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Thermal processes and solidification kinetics of evolution of the microstructure of Sn-xAg-yCu solder alloys

Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Multidisciplinary Program in Materials Science and Engineering, 2005. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/75180840
Date January 2005
CreatorsKinyanjui, Robert.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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