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Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /

Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/273423715
Date January 2008
CreatorsLo, Chi Chuen.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceView abstract or full-text.

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