This thesis deals with the teoretical description of the solder during reflow soldering the solder paste and describing the defects arising during this process. Practical part of the thesis describes the testing of two solder pastes with different silver content before and after the accelerated temperature cycle.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:376992 |
| Date | January 2018 |
| Creators | Dokoupil, Jakub |
| Contributors | Petr, Martinec, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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