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Solder paste inspection and 3D shape estimation using directional LED lightings

Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/227001729
Date January 2007
CreatorsChu, Ming-hei.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceClick to view the E-thesis via HKUTO

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