This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219269 |
| Date | January 2011 |
| Creators | Pelc, Miroslav |
| Contributors | Švecová, Olga, Szendiuch, Ivan |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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