Among communication filters, SAW Filters have been largely used in RF and IF filters of mobile phone because of their small size, high reliability, and the capability to be mass produced. But with increasing of working frequency and miniaturization of SAW package, SAW filters are more sensitive to interference introduced by the package and SAW Pattern. Discrepancy in performance between design and measurement can be large if the packaging effects are not considered.
In this thesis, we use the full wave analysis approach that combining full wave simulator HFSS (High Frequency Structure Simulator) with circuit software to simulate the package effects and the electromagnetic effects of SAW pattern. Our approach has been applied to several cases and measurements are also carried out to verify our results. Good agreements are obtained. We also use this method to discuss the electromagnetic effects inside package, such as the change of the bond wire length. With an accurate prediction, we can save factory design time and production cost.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0707103-223347 |
| Date | 07 July 2003 |
| Creators | Lin, Shin-Hung |
| Contributors | Chih-Wen Kuo, Ken-Huang Lin, Ming-Chih Hsieh, Keh-Yi Lee, Tzong-Lin Wu |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0707103-223347 |
| Rights | campus_withheld, Copyright information available at source archive |
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