Lai, Wai Chiu King. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2002. / Includes bibliographical references (leaves 87-89). / Abstracts in English and Chinese. / LIST OF TABLES --- p.vi / LIST OF FIGURES --- p.vii / Chapter 1. --- Introduction --- p.1 / Chapter 1.1 --- Background --- p.1 / Chapter 1.2 --- Organization of the thesis --- p.3 / Chapter 2. --- Literature Survey --- p.5 / Chapter 2.1 --- Micro Hinges --- p.5 / Chapter 2.2 --- Assembly --- p.5 / Chapter 2.2.1 --- Manual Lift Up Process --- p.5 / Chapter 2.2.2 --- Assembly by On-substrate Actuators --- p.6 / Chapter 2.2.3 --- Assembly by Surface Tension Force --- p.8 / Chapter 2.2.4 --- Assembly by Thermal Shrinkage --- p.8 / Chapter 2.2.5 --- Assembly by Ultrasonic Triboelectricity --- p.9 / Chapter 2.3 --- Summary of Literature Survey --- p.9 / Chapter 3. --- Design & Analysis --- p.11 / Chapter 3.1 --- Micro-Assembly by Centrifugal Force --- p.11 / Chapter 3.2 --- Micro Mass Platform --- p.12 / Chapter 3.2.1 --- Micro Mirror --- p.12 / Chapter 3.2.2 --- Rotation Sensor --- p.15 / Chapter 3.3 --- Fabrication of Micro Structures --- p.16 / Chapter 3.4 --- Force Analysis --- p.18 / Chapter 3.4.1 --- Centrifugal Force --- p.18 / Chapter 3.4.2 --- Van der Waals Forces --- p.20 / Chapter 3.4.3 --- Capillary Force - (1st model) --- p.22 / Chapter 3.4.4 --- Capillary Force - (2nd model) --- p.23 / Chapter 3.4.5 --- Casimir Force --- p.26 / Chapter 3.4.6 --- Spring force of the beam --- p.27 / Chapter 3.4.7 --- Comparison of Forces --- p.28 / Chapter 3.4.8 --- Stress on Polysilicon --- p.30 / Chapter 4. --- Surface Force Measurement --- p.32 / Chapter 4.1 --- Experimental Setup --- p.33 / Chapter 4.2 --- Experimental Result --- p.34 / Chapter 4.2.1 --- Control Experiment of Rotation Sensor --- p.34 / Chapter 4.2.2 --- Freed-state and Snap-down-state --- p.35 / Chapter 4.2.3 --- Summary of the Experimental Data --- p.36 / Chapter 4.3 --- Comparison between Modelled Results and Experimental Data --- p.42 / Chapter 5. --- Assembly Experiment --- p.45 / Chapter 5.1 --- Experimental Setup --- p.45 / Chapter 5.2 --- Experimental Results --- p.46 / Chapter 5.3 --- Comparison among different chips --- p.52 / Chapter 6. --- Assembly Experiment (Double Chips) --- p.57 / Chapter 6.1 --- Experimental Setup --- p.57 / Chapter 6.2 --- Experimental Results --- p.58 / Chapter 6.2.1 --- Surface Profile measurement --- p.58 / Chapter 6.2.2 --- Summary of the surface profile measurement --- p.68 / Chapter 6.2.3 --- Assembly Results --- p.69 / Chapter 7. --- Assembly Experiment (Monitoring System in MUMPs46) --- p.72 / Chapter 7.1 --- Experimental Setup --- p.72 / Chapter 7.2 --- Experimental Results --- p.74 / Chapter 8. --- Other tested micro structures --- p.80 / Chapter 9. --- Conclusion --- p.82 / Chapter 10. --- Future Work --- p.83 / Chapter A. --- Appendix --- p.84 / Bibliography --- p.87
| Identifer | oai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_323903 |
| Date | January 2002 |
| Contributors | Lai, Wai Chiu King., Chinese University of Hong Kong Graduate School. Division of Automation and Computer-Aided Engineering. |
| Source Sets | The Chinese University of Hong Kong |
| Language | English, Chinese |
| Detected Language | English |
| Type | Text, bibliography |
| Format | print, ix, 89 leaves : ill. ; 30 cm. |
| Rights | Use of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/) |
Page generated in 0.002 seconds