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High Dielectric Constant and Low Leakage Current TiO2 Thin Films on Silicon

As the electronic device scale down, replacing conventional SiO2 with high dielectric constant material is very important. Due to its have high dielectric constant (£`// = 170, £`¡æ = 90), high refractive index (~2.5) and high chemical stability. TiO2 is a promising candidate for fabricating thin dielectrics in dynamic random access memory (DRAM) storage capacitors and as gate dielectrics of metal-oxide-semiconductor field effect transistor (MOSFET) without the problem of conventional SiO2 thickness scaling down in ULSI processes because of its high dielectric constant.
TiO2 thin films deposited on p-type (100) Si substrate were investigated by a cold wall horizontal MOCVD system using Ti(i-OC3H7)4, N2O as precursors in the deposition temperature range from 400 ¢J to 650 ¢J.
XRD results indicate that the structures of TiO2 films are polycrystalline and mixture of anatase and rutile phases coexist in the film at the deposition temperature of 650 ¢J. Electrical properties are strongly influenced by deposition temperature. The electrical properties of as-deposited TiO2 films can be improved by annealing treatment. The TiO2 film at the deposition temperature of 650 ¢J has the highest dielectric constant of 100.3 and at the deposition temperature of 550 oC has the lowest leakage current density of 2.07¡Ñ10-7 A/cm2 under the applied electric field of 5 MV/cm after annealing for 20 minutes at 750 ¢J in O2 ambient.
In order to obtain the better electrical properties of TiO2 films on Si substrate, LPD-SiO2 thin films were deposited on the polycrystalline MOCVD-TiO2 films. The minimum equivalent oxide thickness of LPD-SiO2/post-annealed TiO2 film is 51.13

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0713104-142834
Date13 July 2004
CreatorsWu, Tsung-Shiun
Contributorsnone, none, none, Ming-Kwei Lee
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageEnglish
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0713104-142834
Rightswithheld, Copyright information available at source archive

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