In this study, forced convection cooling of package of 2-D parallel boards with heat generating chips is investigated. The main objective of this study is to determine the optimal board-to-board spacing to maintain the temperature of the components below the allowable temperature limit and maximize the rate of heat transfer from parallel heat generating boards cooled by forced convection under constant pressure drop across the package. Constant heat flux and constant wall temperature boundary conditions on the chips are applied for laminar and turbulent flows.
Finite elements method is used to solve the governing continuity, momentum and energy equations. Ansys-Flotran computational fluid dynamics solver is utilized to obtain the numerical results. The solution approach and results are compared with the experimental, numerical and theoretical results in the literature.
The results are presented for both the laminar and turbulent flows. Laminar flow results improve existing relations in the literature. It introduces the effect of chip spacing on the optimum board spacing and corresponding maximum heat transfer. Turbulent flow results are original in the sense that a complete solution of turbulent flow through the boards with discrete heat sources with constant temperature and constant heat flux boundary conditions are obtained for the first time. Moreover, optimization of board-to-board spacing and maximum heat transfer rate is introduced, including the effects of chip spacing.
| Identifer | oai:union.ndltd.org:METU/oai:etd.lib.metu.edu.tr:http://etd.lib.metu.edu.tr/upload/12604891/index.pdf |
| Date | 01 April 2003 |
| Creators | Gurer, Turker |
| Contributors | Yuncu, Hafit |
| Publisher | METU |
| Source Sets | Middle East Technical Univ. |
| Language | English |
| Detected Language | English |
| Type | Ph.D. Thesis |
| Format | text/pdf |
| Rights | To liberate the content for public access |
Page generated in 0.0016 seconds