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Die stress characterization and interface delamination study in flip chip on laminate assemblies

Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/228446679
Date January 2005
CreatorsRahim, Md. Sayed Kaysar, Jaeger, Richard C. Suhling, J. C.
PublisherAuburn, Ala. ,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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