Characterization of die stresses in large area array flip chip packages

Description

Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 134-144).

Links & Downloads

1. http://repo.lib.auburn.edu/EtdRoot/2008/SUMMER/Mechanical_Engineering/Thesis/Roberts_Jordan_55.pdf

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/234540132
Date	January 2008
Creators	Roberts, Jordan Christopher, Jaeger, Richard C., Suhling, J. C.
Publisher	Auburn, Ala.,
Source Sets	OCLC
Language	English
Detected Language	English