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Design and development of stress-engineered compliant interconnect in microelectronic packaging

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/16066
Date08 1900
CreatorsMa, Lunyu
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeDissertation
RightsAccess restricted to authorized Georgia Tech users only.

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